文章摘要
李佳,张铜,白宗旭,刘杰,禇鑫.一体化均热板传热性能试验研究[J].电子机械工程,2019,35(4):44-47
一体化均热板传热性能试验研究
Research on Heat Transfer Performance of Integrated Vapor Chamber
  
DOI:
中文关键词: 热管理  高集成度电子模块  一体化均热板
英文关键词: thermal management  highly integrated electronic module  integrated vapor chamber
基金项目:
中图分类号:TB657.5
作者单位
李佳 中国电子科技集团公司第二十九研究所 
张铜 中国电子科技集团公司第二十九研究所 
白宗旭 中国电子科技集团公司第二十九研究所 
刘杰 中国电子科技集团公司第二十九研究所 
禇鑫 中国电子科技集团公司第二十九研究所 
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中文摘要:
      文中根据大功率、高集成度电子模块的实际应用特点,对典型一体化均热板在不同环境条件下的散热性能进行了试验研究。通过试验确定了一体化均热板在不同热边界条件和热负荷情况下的均温性规律,并得出结论:在温度边界一定时,随着总热耗的成倍增加,均热板整体温度随之上升,上升幅度与热耗增长幅度基本一致;总热耗的增加使得均热板的均温性有比较明显的增强,即均热板的等效导热系数随热耗增加而增大;均热板的均温性在较低热耗下会随着温度边界的增高而提高,但在高热耗下却不再随热边界温度的升高而明显提升。
英文摘要:
      The heat transfer performance of typical integrated vapor chamber under different test conditions is studied based on practical application features of the high-level integration electronic module in this paper.The laws of temperature difference under different thermal boundary condition and heat load are determined by experiment. It is concluded that when the temperature boundary is constant, the overall temperature of the vapor chamber increases with exponential increase of the total heat consumption, and the increase rate is basically the same as that of the heat consumption; that increase of the total heat consumption makes the temperature difference of the vapor chamber more obvious, that is, the equivalent thermal conductivity of the vapor chamber increases with increase of the heat consumption; that the temperature difference of the vapor chamber increases with increase of the temperature boundary at lower heat consumption, but there is no obvious improvement with the increase of the temperature boundary under high heat load.
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