文章摘要
汪艳,刘欣,李帅,刘帆.吹胀型均热板散热分析与结构优化[J].电子机械工程,2020,36(6):28-33
吹胀型均热板散热分析与结构优化
Thermal Analysis and Structure Optimization of Inflation-type Vapor Chamber Fin
  
DOI:
中文关键词: 通讯基站  自然散热  吹胀型均热板  蜂窝管路  最速降线
英文关键词: telecommunication base station  natural convection  inflation-type vapor chamber fin  beehive tube  cycloid
基金项目:
中图分类号:TB657.5
作者单位
汪艳 中兴通讯股份有限公司 
刘欣 中兴通讯股份有限公司 
李帅 中兴通讯股份有限公司 
刘帆 中兴通讯股份有限公司 
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中文摘要:
      文中对用于通讯基站自然散热的吹胀型均热板进行了研究和创新设计。首先采用VOF 模型对业内常用的蜂窝管路结构的吹胀型均热板的热性能进行了仿真分析。结果表明,蜂窝管路由于内部管道互联自由度较高,内部气液掺混,无法形成气液分离的定向循环流动,因此工作时底部易积液,顶部积气,上下侧温度分层严重。针对以上不足,文中设计了3 种最速降线管路结构的吹胀型均热板,新结构可使管道内部形成定向的气液通道,能有效减少底部积液和顶部积气,散热效率更高。实验结果表明,最速降线管路的热阻相对于蜂窝结构散热片的热阻可减少18%。当加热功率为30 W 时,顶部热源温度下降了1.6 ℃。因此,该新型吹胀板散热片具有更好的散热性能,可进一步提升户外通讯基站设备的散热效率。
英文摘要:
      In this paper the inflation-type vapor chamber fin applied in telecommunication base station is studied and designed innovatively. Firstly, thermal performance of the common inflation-type vapor chamber fin with beehive tube structure is simulated and analyzed using VOF model. The results show that the beehive structure vapor chamber fin has poor performance as vapor and liquid blend together in the tube, the liquid gathers at the lower part of the vapor chamber, while the gas gathers at the upper part. And the temperature at the upper part is obviously different from that at the lower part. Three types of inflation-type vapor chamber fin with cycloid curve tube structure are proposed to improve its thermal performance. The cycloid vapor chamber fin constraints the vapor and liquid flows in the designed trace, therefore less liquid gathers at the lower part and less vapor is trapped at the upper part. As a result, its heat dissipation efficiency is improved. The experimental data suggest that thermal resistance of the cycloid structure is 18% lower than that of the beehive structure. When the heat power is 30 W, the temperature of top heat source is reduced by 1.6 ℃. In a word, the new inflation-type vapor chamber fin with cycloid structure tube has better heat performance, which has the potential to provide a better thermal solution for the telecommunication base station
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